Copper powder
OwnerTomoya Yamada, Koji Hiratainventors
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Abstract
A copper powder that is excellent in weatherability and adapted for use in conductive paste is provided that contains 10-20,000 ppm, preferably 100-2,000 ppm, of Sn. The copper powder is particularly preferably one having an average particle diameter DM of 0.1-2 μm and, further, one wherein the particle diameter of at least 80% of all particles is in the range of 0.5 DM-1.5 DM. This copper powder can be produced, for example, by precipitating Cu metal by reduction of Cu ions in the presence of Sn ions.
Claims16
A copper powder containing 10-20,000 ppm of Sn.
A copper powder containing 100-2,000 ppm of Sn.
A copper powder suitable for use as filler in a conductive paste, containing 10-20,000 ppm of Sn, whose average particle diameter DM is 0.1-2 μm and the particle diameter of at least 80% of all particles is in the range of 0.5 DM-1.5 DM.
Dependencies are inferred from the claim text.