Lead frame, sensor including lead frame, resin composition to be used for resin mold in the sensor, and sensor including the resin mold
AssigneeYamaha Corporation
InventorsKenichi Shirasaka, Hiroshi Saitoh
Life of this patent
Estimating the term…
Abstract
A lead frame includes a frame body defining an internal region; a plurality of leads extending from the frame body; a first stage disposed in the internal region; and a first modified connection lead structure comprising a flexible portion connected to the first stage and a modified connection lead connecting the flexible portion to the frame body. The modified connection lead has sloped side walls that permit a molten resin to flow into and fill up a small gap around the modified connection lead to form a void-free resin mold that encapsulates a sensor chip included in a sensor.
Claims23
A lead frame comprising:
- a frame body that defines an internal region;
- a plurality of leads that extend from the frame body;
- a first stage disposed in the internal region;
- and
- a first modified connection lead structure comprising a flexible portion that is connected to the first stage and at least one modified connection lead that connects the flexible portion to the frame body and has sloped side walls.
A sensor comprising:
- a plurality of leads that extend in a first plane;
- a first stage that extends in a second plane that tilts from the first plane;
- a first sensor chip that is supported on the first stage;
- and
- a first modified connection lead structure comprising a flexible portion that is adjacent to the first stage and at least one modified connection lead that connects the flexible portion to the flexible portion, the at least one modified connection lead having sloped side walls.
Dependencies are inferred from the claim text.