Electronic component mounting method and electronic component mounting apparatus

A method of mounting an electronic component, comprising:

• picking up a plurality of electronic components from a component feeding unit by suction using a plurality of suction nozzles;
• detecting postures of the electronic components held by the suction nozzles;
• releasing one of the electronic components that is judged improper as a result of the detecting;
• taking, after the releasing of said one of the electronic components, images of electronic components that are judged proper as the result of the detecting using a component recognition camera;
• performing a recognition processing to the images taken by the component recognition camera;
• releasing another of the electronic components that is judged improper as a result of the recognition processing;
• and
• mounting on a printed board electronic components that are judged proper as the result of the recognition processing after the releasing of said another of the improper electronic components.

A method of mounting an electronic component, comprising:

• picking up a plurality of electronic components from a component feeding unit by suction using a plurality of suction nozzles;
• detecting postures of the electronic components held by the suction nozzles;
• taking images of the electronic components held by the suction nozzles using a component recognition camera;
• performing a recognition processing to the images taken by the component recognition camera;
• mounting on a printed board electronic components judged proper as a result of the detecting and as a result of the recognition processing;
• and
• releasing one of the electronic components that is judged improper as the result of the detecting or as the result of the recognition processing after the mounting of the proper electronic components on the printed board.

An electronic component mounting apparatus comprising:

• a component feeding unit storing a plurality of electronic components;
• a plurality of suction nozzles picking up the electronic components from the component feeding unit;
• a component recognition camera taking images of the electronic components held by the suction nozzles;
• a recognition processing device performing a recognition process to the images taken by the component recognition camera;
• and
• a selection device alternating an operation of the apparatus between a first mounting sequence in which electronic components judged proper as a result of the recognition processing are mounted on a printed board after electronic components judged improper as the result of the recognition process are released from the suction nozzles and a second mounting sequence in which the electronic components judged improper as the result of the recognition process are released from the suction nozzles after the electronic components judged proper as the result of the recognition processing are mounted on a printed board.

An electronic component mounting apparatus comprising:

• a component feeding unit storing a plurality of electronic components;
• a plurality of suction nozzles picking up the electronic components from the component feeding unit;
• a detection device detecting postures of the electronic components held by the suction nozzles;
• a component recognition camera taking images of the electronic components held by the suction nozzles;
• a recognition processing device performing a recognition process to the images taken by the component recognition camera;
• and
• a selection device alternating an operation of the apparatus between a first mounting sequence in which electronic components judged proper as a result of the detecting and as a result of the recognition processing are mounted on a printed board after electronic components judged improper as the result of the detecting or as the result of the recognition process are released from the suction nozzles and a second mounting sequence in which the electronic components judged improper as the result of the detecting or as the result of the recognition process are released from the suction nozzles after the electronic components judged proper as the result of the detecting and as the result of the recognition processing are mounted on a printed board.