Multilayer wiring board and manufacture method thereof

A manufacture method of a multilayer wiring board comprising a core board, and a wiring layer and an electrically insulating layer that are stacked on one surface or both surfaces of said core board, said manufacture method characterized by comprising:

• a step of forming through holes in a core member used for said core board, said core member having a thermal expansion coefficient in XY directions that falls within a range of 2 to 20 ppm, and selected from silicon, ceramics, glass, and a glass-epoxy composite;
• a step of masking both surfaces of said core member other than said through holes and land forming regions using resists;
• a step of filling a conductive material into said through holes and said land forming regions, then polishing both surfaces of said core member, and then peeling off said resists to form said core board;
• a step of forming an electrically insulating layer at predetermined portions of said core board;
• and
• forming wiring layers on one surface or both surfaces of said core board via said electrically insulating layer.

A manufacture method of a multilayer wiring board comprising a core board, and a wiring layer and an electrically insulating layer that are stacked on one surface or both surfaces of said core board, said manufacture method characterized by comprising:

• a step of forming insulating layers on both surfaces of a core member other than through hole forming regions, said core member used for said core board, having a thermal expansion coefficient in XY directions that falls within a range of 2 to 20 ppm, and selected from silicon, ceramics, glass, and a glass-epoxy composite;
• a step of masking said insulating layers using resists;
• a step of applying sandblasting to the core member using said resists as masks, to thereby form through holes in the core member;
• a step of filling a conductive material into said through hole, peeling off said resists, then polishing both sides of the core member to form the core board;
• and
• a step of forming a wiring layer on one surface or both surfaces of said core board via an electrically insulating layer.

A manufacture method of a multilayer wiring board comprising a core board, and a wiring layer and an electrically insulating layer that are stacked on said core board, said manufacture method characterized by comprising:

• a step of forming a plurality of fine holes in a core member, wherein a thermal expansion coefficient of said core board in XY directions falls within a range of 2 to 20 ppm, and said core member is selected from silicon, ceramics, glass, a glass-epoxy composite, and metal;
• a step of causing said fine holes to be conductive by a conductive material;
• a step of stacking a wiring layer and an electrically insulating layer on the core board on the fine hole perforation side to form a multilayer wiring layer;
• a step of polishing a surface of the core board other than a surface where said fine holes are formed, and exposing said fine holes caused to be conductive by said conductive material, thereby to form a plurality of through holes electrically connecting between the front and the back of the core board;
• and
• a step of forming a capacitor on said polished surface of the core board.

A manufacture method of a multilayer wiring board comprising a core board, and a wiring layer and an electrically insulating layer that are stacked on said core board, said manufacture method characterized by comprising:

• a step of forming a plurality of through holes in a core member, wherein a thermal expansion coefficient of said core board in XY directions falls within a range of 2 to 20 ppm, and said core member is selected from silicon, ceramics, glass, a glass-epoxy composite, and metal;
• a step of causing said through holes to be conductive by a conductive material thereby to electrically connect between the front and the back of the core board;
• a step of stacking a wiring layer and an electrically insulating layer on one surface of said core board to form a multilayer wiring layer;
• and
• a step of forming a capacitor on the other surface of said core board.