Heat pump type drying apparatus drying apparatus and drying method
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsTomoichiro Tamura, Yuuichi Yakumaru, Fumitoshi Nishiwaki
Life of this patent
Estimating the term…
Loading patent…
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsTomoichiro Tamura, Yuuichi Yakumaru, Fumitoshi Nishiwaki
Estimating the term…
A drying apparatus has a heat pump comprising a compressor (31), a radiator (32), a throttle apparatus (33) and an evaporator (34), and also includes a structure in which drying air heated by heat of the radiator (32) is introduced to a subject (37) to be dried is dehumidified by the evaporator (34). The drying apparatus also includes a bypass circuit (39) through which a portion of dying air heated by the radiator (32) flows to an inlet of the evaporator (34) without coming into contact with the subject, a super heat detecting device (43, 44) for detecting super heat of the heat pump apparatus, and a throttle apparatus control device for controlling flow path resistance in the bypass circuit (39) using a value detected by the super heat detecting device (43, 44).
A drying apparatus for drying a subject, wherein a refrigerant is circulated through a compressor, a radiator, an expansion mechanism and an evaporator through pipes, said drying apparatus comprising:
A heat pump type drying apparatus comprising:
A drying method for drying a subject located within a circuit, said drying method comprising:
Dependencies are inferred from the claim text.