Connecting flexible circuitry by stitching
OwnerMichael Petersen, Allan Wilson +1inventors
InventorsMichael Petersen, Allan Wilson, Mykola Sherstyuk
Life of this patent
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Abstract
A means is described of connecting multiple flexible printed circuit (FPC) tags. The means is suitable where electrical circuitry has been printed or otherwise applied to one side of flexible substrates, and where the circuitry of two such substrates is required to be brought into electrical continuity. In this method, a sewing, stitching or embroidery machine is used to hold juxtaposed conductive surfaces in electrical continuity by tension. In a variation of the means, conductive thread, wire or other material is used to create an electrically-conducting via between the relevant conductive surfaces of two or more such FPC tags.
Claims9
A method of connecting two or more layers of flexible printed circuitry (FPC) each having at least one conducting pathway thereon, where electrical continuity between the respective conducting pathways is required, comprising:
- providing two or more non-conductive, flexible substrates;
- bringing such substrates into close juxtaposition whereby the at least one conducting pathway of one of said substrates is in electrical contact with the at least one conducting pathway of an other of said substrates;
- and
- sewing such substrates together so as to maintain said conducting pathways in electrical contact with each other
The method of claim, where non-conducting thread is used to hold the juxtaposed conducting surfaces of two FPC tags in electrically-conductive contact by tension.
A method of connecting two or more layers of flexible printed circuitry (FPC) each having at least one conducting pathway thereon, where electrical continuity between the respective conducting pathways is required, comprising:
- providing two or more non-conductive, flexible substrates;
- bringing such substrates into close juxtaposition whereby one of said substrates is in contact with the at least one conducting pathway of an other of said substrates so as to act as a dielectric with respect thereto;
- and
- sewing such substrates together using an electrically conductive thread, wire or other material so as to create an electrically conductive pathway between the at least one conducting pathway of said one substrate and the at least one conducting pathway of said other substrate.
Dependencies are inferred from the claim text.