# US 2006/0151575 A1 · Method of producing shaped bodies, particularly cores, molds and feeders for use in foundry practice > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2006/0151575 A1 - Document ID: US20060151575A1 - Status: Published application - Kind: A1 - Application number: 10/537,530 - Filed: 2003-12-05 - Published: 2006-07-13 - Earliest claimed: 2002-12-05 - Inventors: Antoni Gienic; Henning Rehse; Dieter Koch; Gunter Weicker; Dietmar Chmielewski - Web page: https://patentgrep.com/patent/US20060151575A1 ## CPC - B22C 1/2253: {with phenols} - B22C 1/2273: {Polyurethanes; Polyisocyanates} - C08G 18/542: {with phenols} - B22C: FOUNDRY MOULDING (moulding refractory materials in general B28B) - C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ## Abstract The present invention relates to a process for producing shaped bodies, in particular cores, molds and feeders in foundry technology, which comprises the following steps: a. Preparation of a composition comprising i. at least one phenolic resin in solid form, ii. at least one polyisocyanate, and iii. at least one refractory material, with the composition being prepared at a temperature which is below the melting point of the at least one phenolic resin; b. Molding of the composition to form a shaped body; c. Raising of the temperature of the composition to above the melting point of the at least one phenolic resin to cure the mixture. The invention also relates to shaped bodies, in particular cores, molds and feeders for foundry technology, which are obtainable by this process, and also a composition as is used in this process. ## Claims ### Claim 1 A process for producing shaped bodies, in particular cores, molds and feeders in foundry technology, which comprises the following steps: preparing a composition comprising blending a phenolic resin in solid form, a polyisocyanate, and a refractory material, at a temperature below the melting point of the phenolic resin; molding the composition to form a shaped body; and raising the temperature of the shaped body to above the melting point of the phenolic resin to cure the composition. ### Claim 2 (depends on 1) The process as claimed in claim 1, wherein the refractory material is mixed with the phenolic resin, to produce a mixture prior to addition of the polyisocyanate. ### Claim 3 (depends on 1) The process claim 1, wherein the molding to form a shaped body is carried out in a heated tool. ### Claim 4 (depends on 1) The process of claim 1, wherein the refractory material is selected from the group consisting of silica sand, olivine, chromite sand, zircon sand, vermiculite, synthetic mold materials such as Cerabeads and microspheres and mixtures thereof. ### Claim 5 (depends on 4) The process of claim 4, wherein the microspheres comprise hollow microspheres. ### Claim 6 (depends on 1) The process of claim 1, further comprising adding an exothermic constituent to the composition. ### Claim 7 (depends on 1) The process of claim 1, wherein the production of the shaped body is carried out without addition of a solvent. ### Claim 8 (depends on 1) The process of claim 1, wherein the polyisocyanate is dissolved in a solvent in which the phenolic resin is insoluble or sparingly soluble. ### Claim 9 (depends on 1) The process of claim 1, wherein the polyisocyanate comprises an isocyanate having at least 2, isocyanate groups per molecule. ### Claim 10 (depends on 1) The process of claim 1, wherein the polyisocyanate is selected from an aliphatic, cycloaliphatic, and an aromatic polyisocyanate and mixtures thereof. ### Claim 11 (depends on 10) The process of claim 10, wherein the aromatic polyisocyanate comprises diphenylmethane diisocyanate in admixture with its higher homologues. ### Claim 12 (depends on 1) The process of claim 1, wherein the phenolic resin comprises novolak. ### Claim 13 (depends on 1) The process of claim 1 further comprising curing the shaped body at a temperature of from about 150° C. to about 300° C. ### Claim 14 (depends on 13) The process of claim 13, wherein curing is carried out without addition of a catalyst. ### Claim 15 (depends on 1) The process of claim 1, further comprising adding a catalyst to the composition. ### Claim 16 (depends on 1) The process of claim 1 further comprising adding a compound which lowers the melting point of the phenolic resin to the composition. ### Claim 17 (depends on 1) A shaped body, in particular a core, mold or feeder for foundry technology, prepared by the process of claim 1. ### Claim 18 (depends on 17) The shaped body of claim 17 which is free of solvents or gaseous catalysts. ### Claim 19 A composition for producing shaped bodies, in particular cores, molds and feeders, comprising a solid phenolic resin, a polyisocyanate, and a refractory material. ### Claim 20 (depends on 19) The composition of claim 19, characterized in that the refractory material comprises hollow microspheres. ### Claim 21 (depends on 19) The composition of claim 19, wherein no solvent for either the phenolic resin or the polyisocyanate is present. ### Claim 22 (depends on 19) The composition of claims 19, wherein the phenolic resin comprises novolak. ### Claim 23 (depends on 1) The process of claim 1, wherein the refractory material is coated with the phenolic resin prior to the addition of the polyisocyanate. ### Claim 24 (depends on 4) The process of claim 4, wherein the hollow microspheres comprise aluminum silicate. ### Claim 25 (depends on 4) The process of claim 4, wherein the hollow microspheres have an aluminum oxide content greater than about 40% by weight. ### Claim 26 (depends on 4) The process of claim 4, wherein the hollow microspheres have an aluminum oxide content less than about 40% by weight. ### Claim 27 (depends on 6) The process of claim 6, wherein the exothermic constituent is selective from an oxidizable metal, an oxidant, fluorine carriers and mixtures thereof. ### Claim 28 (depends on 8) The process of claim 8 wherein the polyisocyanate solvent is selected from an aromatic solvent, a fatty acid solvent and mixtures thereof. ### Claim 29 (depends on 10) The process of claim 10, wherein the aromatic polyisocyanate is liquid at room temperature. ### Claim 30 (depends on 11) The process of claim 11, wherein the higher homologues comprise polymeric MDI having a functionality of from about 2 to about 4. ### Claim 31 (depends on 12) The process of claim 12, wherein the novolak has a melting point in the range from about 60 to about 120° C. ### Claim 32 (depends on 20) The process of claim 20, wherein the hollow microspheres comprise aluminum silicate. ### Claim 33 (depends on 20) The process of claim 20, wherein the hollow microspheres have an aluminum silicate content greater than about 40% by weight. ### Claim 34 (depends on 20) The process of claim 20, wherein the hollow microspheres have an aluminum silicate content less than about 40% by weight. ### Claim 35 (depends on 19) The process of claim 19, wherein the novolak has a melting point in the range from about 60 to about 120° C.