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US 2006/0151434 A1Published application
Selective surface texturing through the use of random application of thixotropic etching agents
AssigneeThe BOC Group, Inc.
InventorsJohn Deem, David Laube
Life of this patent
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Abstract
An improved process for predictably treating a substrate surface is provided comprising the use of a pre-selected thixotropic etchants to achieve a superior and predetermined substrate surface.
Claims17
A thixotropic compound made from a composition selected from the group consisting of:
- aqua regia-containing, ferric chloride-containing ;
- hydrogen peroxide/HCl-containing, and potassium hydroxide-containing solutions, said solutions treated with an amount of fumed silica.
A method for treating a substrate surface comprising the steps of:
- providing a substrate having a surface;
- providing a thixotropic etching compound;
- applying the thixotropic etching compound to the substrate surface and exposing the surface to the compound for a pre-selected time;
- and
- removing the thixotropic compound from the substrate surface.
2 more elements
A method for treating a substrate surface comprising the steps of:
- providing a substrate having a surface;
- providing a thixotropic etching compound, said compound comprising a solution selected from the group consisting of:
- aqua regia-containing, ferric chloride-containing;
- hydrogen peroxide/HCl-containing, and potassium hydroxide-containing solutions, said solution treated with an amount of fumed silica;
- applying the thixotropic etching compound to the substrate surface and exposing the surface to the compound for a pre-selected time;
- and
- removing the thixotropic compound from the substrate surface.
4 more elements
A method of predictably increasing the roughness of a substrate surface comprising the steps of:
- providing a substrate having a surface;
- providing a thixotropic etching compound, said compound comprising a solution selected from the group consisting of:
- aqua regia-containing, ferric chloride-containing, hydrogen peroxide/HCl-containing, and potassium hydroxide-containing solutions, said solutions treated with an amount of fumed silica;
- applying the thixotropic etching compound to the substrate surface and exposing the substrate surface to the compound for a pre-selected time;
- and
- removing the thixotropic compound from the substrate surface.
3 more elements
A metal part having a surface treated with a thixotropic etching agent selected from the group consisting of:
- aqua regia-containing, ferric chloride-containing, hydrogen peroxide/HCl-containing, and potassium hydroxide-containing solutions, said solutions treated with an amount of fumed silica.
Dependencies are inferred from the claim text.