Back to results
US 2006/0150137 A1Published application
Three dimensional integrated circuits
OwnerRaminda Maduraweinventor
Life of this patent
Estimating the term…
Abstract
A three-dimensional semiconductor device, comprising: a circuit block located in a first module layer; and a configuration circuit to control the circuit block further comprising a configurable element in a second module layer positioned above the first module layer.
Claims20
A three-dimensional semiconductor device, comprising:
- a configuration circuit to generate a digital signal, further comprised of:
- a first element to generate a digital one signal;
- and
- a second element to generate a digital zero signal;
- and
- a first module layer comprising a plurality of circuit blocks, wherein at least one of the circuit blocks is controlled by the digital signal;
- and
- a second module layer comprising one of said first or second elements positioned substantially above the first module layer.
5 more elements
A programmable semiconductor device, wherein:
- a circuit block comprises a transistor in a in a first module layer;
- and
- a configuration circuit to control the circuit block comprising a transistor in a second module layer positioned above the first module layer.
A three-dimensional semiconductor device, comprising:
- a circuit block located in a first module layer;
- and
- a configuration circuit to control the circuit block further comprising a configurable element in a second module layer positioned above the first module layer.
Dependencies are inferred from the claim text.