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US 2006/0149974 A1Published application
Device and method for on-die temperature measurement
AssigneeIntel Corporation
InventorsEfraim Rotem, Jim Hermerding, Eric Distefano, Barnes Cooper
Life of this patent
Estimating the term…
Abstract
A system for measuring and managing thermal operations of a processor core on a semiconductor die using a sensor positioned in a hotspot of the processor core. A measured temperature reading is determined based upon a temperature sensed by the sensor. Interrupt signals and a software readable register indicating temperature information provide feedback about the thermal environment to the processor. Based upon the measured temperature reading, the interrupt signals direct the processor to modify operation.
Claims52
A system comprising:
- a processor having a hotspot during operation, the hotspot being a localized region having a higher temperature than regions of the processor adjoining the hotspot;
- means for sensing a temperature within the hotspot;
- means for generating a measured temperature reading based upon the temperature sensed by said means for sensing;
- means for directing the processor to modify processor-operation based upon the measured temperature reading;
- a semiconductor die comprising said processor, said means for sensing, said means for generating, and said means for directing;
- and
- means for thermal management, external to the semiconductor die and responsive to output from the means for directing the processor.
4 more elements
A device comprising:
- a processor having a hotspot during operation, the hotspot being a localized region having a higher temperature than regions of the processor adjoining the hotspot;
- a p-n junction within the hotspot, a junction voltage of the p-n junction to change as a function of the temperature of the hotspot of the processor;
- a comparator to compare a voltage from of the p-n junction with a voltage representing a first threshold temperature value;
- an analog-to-digital converter to convert the voltage from the p-n junction into a measured temperature reading;
- a logic circuit to monitor the measured temperature reading to determine occurrence of particular thermal events to direct the processor to modify processor-operation when a thermal event occurs;
- and
- a semiconductor die comprising the processor, the p-n junction, the comparator, the analog-to-digital converter, and the logic circuit.
4 more elements
A device comprising:
- a processor having a hotspot during operation, the hotspot being a localized region having a higher temperature than regions of the processor adjoining the hotspot;
- a p-n junction within the hotspot, a junction voltage of the p-n junction to change as a function of the temperature of the hotspot of the processor;
- a control circuit comprising:
- a number generator to generate a binary number from a plurality of binary numbers corresponding to temperature values within a temperature range;
- a digital-to-analog converter to convert the binary number of the plurality of binary numbers into a voltage;
- a first comparator to compare a voltage from the p-n junction with the voltage from the digital-to-analog converter;
- and
- a register for holding a measured temperature reading, the register to be set to the binary number as the measured temperature reading if the voltage from the p-n junction approximately equals the voltage from the digital-to-analog converter,
- a logic circuit to monitor the register to determine occurrence of particular of thermal events to direct the processor to modify processor-operation when a thermal event occurs;
- and
- a semiconductor die comprising the processor, the p-n junction, the control circuit, and the logic circuit.
8 more elements
A method comprising:
- sensing a temperature of a hotspot of a processor on a semiconductor die, the hotspot being a localized region having a higher temperature than regions of the processor adjoining the hotspot;
- determining whether the sensed temperature equals or exceeds a threshold temperature;
- generating a temperature reading in accordance with the sensed temperature;
- and
- controlling internal operations of the processor to regulate temperature based upon the temperature reading,
- each of said sensing, said determining, said generating, and said controlling being performed by structures internal to the semiconductor die.
3 more elements
A device comprising:
- a plurality of processors, each processor having at least one hotspot during operation, each hotspot being a localized region having a higher temperature than regions of the processor adjoining the hotspot;
- and
- a routing matrix comprising memory storing a decision table, the routing matrix to receive thermal event indications, each thermal event indication to indicate that one of the hotspots has reached a threshold temperature, to route thermal event directives to the processors in accordance with the decision table.
Dependencies are inferred from the claim text.