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US 2006/0149023 A1Published application
Phosphorus-containing cured benzoxazine resins and preparation thereof
AssigneeNational Cheng Kung University
InventorsChun Wang, Jeng Shieh, Chi Lin, Wan Hsieh
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Abstract
A series of novel phosphorus-containing cured benzoxazine resins, which are synthesized from dihydrobenzoxazine resins with reactive phosphorus-containing compounds. The cured benzoxazine resins have desired flame retardancy and high glass transition temperature, and are suitable for the fabrication of printed circuit board and the semiconductor encapsulant applications.
Claims28
A phosphorus-containing cured benzoxazine resin comprising the following chemical structure (I), (II) or (III):
- wherein the bracket in the formulas (I) to (III) represents a repeating unit, and the cured benzoxazine resin has more than one repeating units;
- G is G1 or G2:
- wherein r=H, C1˜C6, or aryl, and n=0˜5;
- X1:
- wherein Ar is defined as above;
- Y:
- wherein X has the same definition as X1.
4 more elements
A phosphorus-containing cured benzoxazine resin comprising the following chemical structure (IV), (V) or (VI):
- wherein the bracket in the formulas (IV) to (VI) represents a repeating unit, and the cured benzoxazine resin has more than one repeating units;
- X1:
- wherein G is G1 or G2;
- X2 has the same definition as X1;
- R1 is defined as the following R;
- wherein r=H, C1˜C6, or aryl, and n=0˜5;
- wherein AR is defined as above;
- Y:
- wherein X has the same definition as X1.
6 more elements
Dependencies are inferred from the claim text.