Back to results
US 2006/0142971 A1Published application
All surface data for use in substrate inspection
AssigneeRudolph Technologies, Inc.
InventorsDavid Reich, Kenneth Durden, Randall Shay
Life of this patent
Estimating the term…
Abstract
A system for capturing, calibrating and concatenating all-surface inspection and metrology data is herein disclosed. Uses of such data are also disclosed.
Claims19
A method of generating inspection data regarding at least a portion of a semiconductor wafer comprising:
- capturing inspection data concerning at least two surfaces of the semiconductor wafer;
- calibrating the inspection data concerning the at least two surfaces of the semiconductor wafer such that a single coordinate system may define locations on the at least two surfaces of the semiconductor wafer;
- and
- concatenating the inspection data concerning the at least two surfaces of the semiconductor wafer into a single data structure.
1 more element
A method of generating inspection data regarding at least a portion of a semiconductor wafer comprising:
- capturing inspection data concerning at least two surfaces of the semiconductor wafer;
- calibrating the inspection data concerning the at least two surfaces of the semiconductor wafer such that there exists at least one common referent is shared amongst substantially all the inspection data on the at least two surfaces;
- and
- concatenating the inspection data concerning the at least two surfaces of the semiconductor wafer into a single data structure.
1 more element
Dependencies are inferred from the claim text.