Substrate processing apparatus, method of controlling substrate, and exposure apparatus
AssigneeCanon Kabushiki Kaisha
InventorRyo Edo
Life of this patent
Estimating the term…
Abstract
A load-lock apparatus including a load-lock chamber, a chuck, arranged in the load-lock chamber, to hold a substrate, a pressure reduction system to reduce a pressure in the load-lock chamber using an exhaust valve, a pressure measurement system to measure a pressure in the load-lock chamber, and a time measurement system to measure an operating time of the pressure reduction system. The exhaust valve is controlled such that a relationship between a pressure measured by the pressure measurement system and a time measured by the time measurement system falls within a predetermined range with respect to a predetermined relationship.
Claims2
1-19. (canceled)
A load-lock apparatus comprising:
- a load-lock chamber;
- a chuck, arranged in said load-lock chamber, to hold a substrate;
- a pressure reduction system to reduce a pressure in said load-lock chamber using an exhaust valve;
- a pressure measurement system to measure a pressure in said load-lock chamber;
- and
- a time measurement system to measure an operating time of said pressure reduction system,
- wherein said exhaust valve is controlled such that a relationship between a pressure measured by said pressure measurement system and a time measured by said time measurement system falls within a predetermined range with respect to a predetermined relationship.
Dependencies are inferred from the claim text.