Phosphazene compound, photosensitive resin composition and use thereof

A photosensitive resin composition having at least a polyimide resin (G) and a phosphazene compound (H), said photosensitive resin composition comprising:

• a soluble polyimide resin (G-1), which has a carboxyl group and/or a hydroxyl group and is soluble in an organic solvent, as the polyimide resin (G);
• and
• a phenoxyphosphazene compound (H-1) having a phenolic hydroxyl group and/or a cross-linked phenoxyphosphazene compound (H-2), which is obtained by cross-linking the phenoxyphosphazene compound (H-1) and has at least one phenolic hydroxyl group, as the phosphazene compound (H),
• said photosensitive resin composition further comprising a (meth)acrylic compound (I).

A photosensitive resin composition, comprising a soluble polyimide resin (K) having a carboxyl group and/or a hydroxyl group, a phenoxyphosphazene compound (L), and a (meth)acrylic compound (M),

• said phenoxyphosphazene compound (L) including at least one of a circular phenoxyphosphazene compound (L-1) represented by formula (22) and a chain phenoxyphosphazene compound (L-2) represented by formula (23),
• where a represents an integer ranging from 3 to 30,
• where R25 represents group-N═P(OPh)3 or group-N═P(O)OPh, and R26 represents group—P(OPh)4 or group—P(O)(OPh)2, and b represents an integer ranging from 3 to 10000, wherein
• the phenoxyphosphazene compound (L) includes a cross-linked phenoxyphosphazene compound (L-3) having a structure cross-linked by causing a cross-linking group having any one of an o-phenylene group, an m-phenylene group, a p-phenylene group, and a bisphenylene group represented by formula (3) to intervene between two oxygen atoms obtained by desorbing a phenyl group,
• where R7 represents —C(CH3)2—, —SO2—, —S—, or —O—, and p represents 0 or 1.