A method for the corrective grinding, fine polishing and cleansing of smooth surfaces, including surfaces coated with metals and thin films, of diverse rigid and semi-rigid materials of medium and high hardness as well as for the polishing and flattening of semiconductor surfaces comprising taking a high precision polishing tool for fine grinding and polishing of flat or curved optical surfaces, as well as for the optical flattening of semiconductor and metal surfaces, where the tool comprises:
- a plurality of cylindrical sections made of previously machined stainless steel or ceramic, where, the plurality of cylindrical sections are coupled to each other by means of a series of peripheral screws, said cylindrical sections consisting of a mixing module, where the mixing module mixes two or more components of a polishing mixture, a module comprising one or more rotational acceleration chambers, an aerostatic suspension system, a throat actuator, a material recovery groove, an exit nozzle and a divergent radial nozzle.