Apparatus and process for treating dielectric materials

An apparatus for processing a dielectric material, the apparatus comprising:

• a radiation source module comprising a reflector, an ultraviolet radiation source, and a plate transmissive to the wavelengths of about 150 nm to about 300 nm, to define a sealed interior region, wherein the sealed interior region is in fluid communication with a first fluid source;
• a process chamber module coupled to the radiation source module to define a sealed chamber in operative communication with the ultraviolet radiation source, the process chamber comprising a closable opening adapted to receive a substrate, a support adapted to support the substrate, and a gas inlet in fluid communication with a second fluid source;
• and
• a loadlock chamber module in operative communication with the process chamber and a wafer handler;
• the loadlock chamber comprising an airlock chamber in fluid communication with a third fluid source and a chuck.