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US 2006/0141787 A1Published application
Cleaning methods for silicon electrode assembly surface contamination removal
AssigneeLam Research Corporation
InventorsDaxing Ren, Hong Shih
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Abstract
Silicon electrode assembly decontamination cleaning methods and solutions, which control or eliminate possible chemical attacks of electrode assembly bonding materials, comprise ammonium fluoride, hydrogen peroxide, acetic acid, optionally ammonium acetate, and deionized water.
Claims27
A method of cleaning a used electrode assembly comprising a plasma-exposed silicon surface comprising:
- contacting the silicon surface with a solution of isopropyl alcohol and deionized water;
- contacting the silicon surface with an acidic solution comprising:
- 0.01-5% ammonium fluoride;
- 5-30% hydrogen peroxide;
- 0.01-10% acetic acid;
- optionally 0-5% ammonium acetate;
- and
- balance deionized water;
- and
- contacting the silicon surface with deionized water;
- wherein contaminants are removed from the silicon surface.
8 more elements
An acidic solution for removing contaminants from a plasma-exposed silicon surface of a used electrode assembly comprising:
- 0.01-5% ammonium fluoride;
- 5-30% hydrogen peroxide;
- 0.01-10% acetic acid;
- optionally 0-5% ammonium acetate;
- and
- balance deionized water.
3 more elements
Dependencies are inferred from the claim text.