Method of manufacturing wiring board

A method of manufacturing a wiring board having a capacitor with a plurality of electrode layers which layers oppose each other with a dielectric layer in between, which capacitor is connected to a semiconductor chip;

• one or more via wirings which pierce the electrode layers and which are connected to the semiconductor chip;
• and a plurality of pattern wirings which pattern wirings are connected to the corresponding via wirings, the method comprising the steps of:
• forming the electrode layers, each having one or more through holes which the via wirings pierce, and the dielectric layer, and forming the capacitor;
• installing the capacitor such that the capacitor opposes the pattern wirings with an insulating layer in between;
• forming one or more via holes which reach the pattern wirings from the through holes;
• and
• forming the via wirings in the via holes;
• wherein the step of forming the via holes includes forming the via holes in the insulating layer with the electrode layers as a mask.