US 2006/0141761 A1 · System for and method of forming via holes by multiple deposition events in a continuous inline shadow mask deposition process

Abstract

Via holes are formed in a continuous inline shadow mask production system by depositing a first conductor layer and subsequently depositing a first insulator layer over a portion of the first conductor layer. The first insulator layer is deposited in a manner to define at least one notch along its edge. The second insulator layer is then deposited on another portion of the first conductor layer in a manner whereupon the second insulator layer slightly overlaps each notch of the first insulator layer, thereby forming the one or more via holes. A conductive filler can optionally be deposited in each via hole. Lastly, a second conductive layer can be deposited over the first insulator layer, the second insulator layer and, if provided, the conductive filler.

Claims20

Dependent claims

A shadow mask vapor deposition method comprising:

(a) vapor depositing a first conductor layer on a substrate;
(b) separately vapor depositing a pair of insulator layers on the first conductor layer, wherein one of the pair of deposited insulator layers defines a slot along an edge thereof and the combination of the slot and an edge of the other of the pair of deposited insulator layers define a via hole;
and
(c) vapor depositing a second conductor layer on the first and second insulator layers, wherein the first and second conductor layers are electrically connected by way of an electrical conductor in the via hole.

1 more element

Dependencies are inferred from the claim text.

System for and method of forming via holes by multiple deposition events in a continuous inline shadow mask deposition process

Life of this patent

System for and method of forming via holes by multiple deposition events in a continuous inline shadow mask deposition process

Life of this patent

Abstract

Claims20