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US 2006/0141749 A1Published application
Adhesive of folder package
AssigneeIntel Corporation
InventorsRahul Manepalli, Karen Paghasian, Shinobu Kourakata, Ruel Aranda
Life of this patent
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Abstract
A package includes a flexible substrate with a first region and a second region, an encapsulated die supported by the first region, and a conformable fold adhesive introduced between the encapsulated die and the flexible substrate. The second region of the flexible substrate is folded over the surface of the encapsulated die.
Claims16
A package comprising:
- a flexible substrate with a first region and a second region;
- an encapsulated die supported by the first region, the second region of the flexible substrate folded over the surface of the encapsulated die;
- and
- a conformable fold adhesive introduced between the encapsulated die and the flexible substrate.
1 more element
A system comprising:
- a flexible substrate with a first region and a second region;
- an encapsulated die supported by the first region, the second region of the flexible substrate folded over the surface of the encapsulated die;
- a conformable fold adhesive introduced between the encapsulated die and the flexible substrate;
- and
- at least one of an input device and an output device coupled to the encapsulated die.
2 more elements
Dependencies are inferred from the claim text.