System and method of forming a bonded substrate and a bonded substrate product
AssigneeASML Netherlands B.V.
InventorsKeith Best, Joseph Consolini
Life of this patent
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Abstract
The invention provides a method of forming a bonded substrate that includes providing a first substrate having a first substrate shape and at least one first alignment mark positioned at a first surface side. A second substrate is providing having a second substrate shape. The second substrate is oriented relative to the first substrate in a predetermined orientation. The second substrate is bonded to the first surface side of the first substrate to render the bonded substrate, such that the bonded second substrate does not cover the at least one first alignment mark.
Claims17
A method of forming a bonded substrate, comprising:
- providing a first substrate having a first substrate shape and having at least one first alignment mark that is positioned at a first surface side;
- providing a second substrate having a second substrate shape;
- orienting said second substrate relative to said first substrate in a predetermined orientation;
- and
- bonding said second substrate to said first surface side of said first substrate to provide a bonded substrate, such that said bonded second substrate does not cover said at least one first alignment mark.
A bonded substrate, comprising:
- a first substrate having a first outer circumference and at least one first alignment mark that is positioned at a first surface side;
- and
- a second substrate that is positioned on top of said first substrate, the second substrate having a second outer circumference, wherein said second outer circumference, when projected on said first surface side of said first substrate in a direction substantially perpendicular to the first surface side, is at least partly enclosed by said first outer circumference, such that said at least one first alignment mark is exposed.
A device manufacturing method, comprising:
- providing a first substrate having a first substrate shape and having at least one first alignment mark that is positioned at a first surface side;
- providing a second substrate having a second substrate shape;
- orienting the second substrate relative to said first substrate in a predetermined orientation;
- bonding the second substrate to the first surface side of the first substrate to provide a bonded substrate, wherein the second substrate does not cover the at least one first alignment mark when the second substrate is bonded to the first substrate;
- providing a projection beam of radiation;
- using a pattern to impart the projection beam with a patterned cross-section;
- and
- projecting the patterned beam of radiation onto a target portion of the bonded substrate
Dependencies are inferred from the claim text.