Method for measuring bonding quality of bonded substrates, metrology apparatus, and method of producing a device from a bonded substrate

A method of producing a device from a bonded substrate having a top substrate on top of a bottom substrate, the method comprising:

• creating a plurality of marks at a first side of the top substrate;
• bonding the top substrate onto the bottom substrate to form the bonded substrate;
• measuring positions of the plurality of marks;
• calculating, for each of the plurality of marks, a difference between a measured position and an expected position;
• determining delamination areas at an interface between the top substrate and the bottom substrate using the calculated difference;
• determining whether the bonded substrate meets a predetermined quality criteria, and if not, rejecting the bonded substrate, and if so,
• projecting a patterned beam of radiation onto a target portion of the bonded substrate.