Processing a memory link with a set of at least two laser pulses
OwnerYunlong Sun, Edward Swenson +1inventors
InventorsYunlong Sun, Edward Swenson, Richard Harris
Life of this patent
Estimating the term…
Abstract
A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of each laser pulse (52) within the set (50) is preferably within a range of about 0.1 ps to 30 ns. The set (50) can be treated as a single “pulse” by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a set (50) of laser pulses (52) at each link (22). Conventional IR wavelengths or their harmonics can be employed.
Claims24
A method for laser severing a conductive link in an integrated circuit (IC), the method comprising:
- providing position data representative of locations of one or more conductive links;
- generating at least two laser pulses, the laser pulses including a first laser pulse and a second laser pulse, each of the first and second laser pulses producing a laser spot at the integrated circuit;
- and
- directing, based on the position data, the laser pulses to a selected conductive link to sever the selected conductive link, wherein the laser spots are in movement relative to the selected conductive link while the laser pulses are directed to the selected conductive link, the first and second laser pulses are sequentially directed to the selected conductive link, and at least one of the first and second laser pulses removes a depth of link material that is less than the link thickness.
A method for laser severing a conductive link in an integrated circuit (IC), the method comprising:
- providing position data representative of locations of one or more conductive links;
- generating at least two laser pulses, the laser pulses including a first laser pulse and a second laser pulse;
- and
- directing, based on the position data, the laser pulses to a selected conductive link to sever the selected conductive link, wherein the first and second laser pulses are sequentially directed to the selected conductive link, and at least one of the first and second laser pulses removes a depth of link material that is less than the link thickness.
A method for laser severing a conductive link in an integrated circuit (IC), the method comprising:
- providing position data representative of locations of one or more conductive links;
- generating a beam comprising at least two laser pulses, the laser pulses including a first laser pulse and a second laser pulse;
- and
- directing, based on the position data, the laser pulses to a selected conductive link to sever the selected conductive link, wherein the selected conductive link and the beam are in relative movement while the laser pulses are directed to the selected conductive link, the first and second laser pulses are sequentially directed to the selected conductive link, and at least one of the first and second laser pulses removes a depth of link material that is less than the link thickness.
Dependencies are inferred from the claim text.