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US 2006/0141676 A1Published application
Method for producing semiconductor substrate
OwnerKei Murayama, Mitsutoshi Higashiinventors
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Abstract
To provide a method for producing a semiconductor substrate able to uniformly and quickly fill through-holes in the semiconductor substrate with conductive material. This method comprises a process for forming through-holes (14) in a substrate (10), a process for disposing solder (42) on one surface of the substrate, and a process for pressing the solder on a side of the substrate by a press (40) and heat-melting the solder to fill the through-holes in the substrate with the solder.
Claims5
A method for producing a semiconductor substrate, comprising the following steps of:
- forming through-holes in a substrate, disposing molten solder on one surface of the substrate, and pressing the solder onto the substrate by a press while heating to melt the solder to be filled into the through-holes in the substrate.
Dependencies are inferred from the claim text.