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US 2006/0141674 A1Published application
Windowed package having embedded frame
AssigneeIntel Corporation
InventorsZong-Fu Li, Kabul Sengupta, Deborah Thompson
Life of this patent
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Abstract
An integrated circuit (IC) package includes a mold compound, a die, and a window. The mold compound has a frame embedded within it. The frame has a top surface, a bottom surface, and a top-to-bottom opening therein. The die is attached to the mold compound, wherein the embedded frame lies below a periphery of the die. The window is attached to the mold compound and located above the die to allow light to reach the die.
Claims9
A method of making an IC package, the method comprising:
- placing a frame in a mold wherein the frame has a top surface, a bottom surface, and a top-to-bottom opening therein;
- substantially surrounding the frame with a mold compound;
- attaching a die to the mold compound including positioning the die so that its periphery lies over the frame;
- attaching the die to a lead frame of the IC package;
- and
- enclosing the die by attaching a window to the mold compound above the die.
3 more elements
A method of making an IC package, the method comprising:
- attaching a die to a mold compound having a frame embedded within it including positioning the die so that its periphery lies over the frame wherein the frame has a top surface, a bottom surface, and a top-to-bottom opening therein;
- attaching the die to a lead frame of the IC package;
- and
- attaching a window to the mold compound above the die, to enclose the die.
1 more element
Dependencies are inferred from the claim text.