Integrated circuit device having reduced bow and method for making same
AssigneeMicron Technology, Inc.
InventorsWilliam Tandy, Matt Schwab, Cary Baerlocher
Life of this patent
Estimating the term…
Abstract
An integrated circuit device includes a semiconductor component coupled with a lead frame, and an integrated circuit package encompassing at least a portion of the semiconductor component. The package has a first surface and a second surface, and side surfaces, where the first surface is opposite the second surface. A parting line of the integrated circuit package is offset toward the second surface of the package, where the first surface optionally comprises the bottom surface of the package. The first surface of the package has one or more recessed areas.
Claims20
A method comprising:
- coupling a semiconductor device to a leadframe;
- forming a package on at least a portion of the semiconductor device and over a portion of the lead frame and forming a parting line, where the package has a first surface and a second surface and side surfaces;
- forming a die area corresponding to at least the semiconductor device, and the die area has a substantially uniform first thickness;
- and
- forming a first area surrounding at least a portion of the die area, wherein at least a portion of the first area is remote from the side surfaces, and the first area has a second thickness less than the first thickness.
A method comprising:
- coupling a semiconductor device to a leadframe;
- encompassing at least a portion of the semiconductor device and a portion of the lead frame with a package, where the package has a first surface and a second surface, and side surfaces;
- forming a die area corresponding to at least the semiconductor device, and the die area has a substantially uniform first thickness;
- and
- forming a recessed area defined by the first surface without the die area, and a portion of the recessed area is remote from the side surfaces.
A method comprising:
- coupling a semiconductor device to a leadframe;
- coupling a package with at least a portion of the semiconductor device and a portion of the lead frame, where the package has a first surface and a second surface, and side surfaces;
- forming a die area along the first surface, and the die area corresponds to at least the semiconductor device, and the die area has a substantially uniform planar profile;
- and
- forming a recessed area defined by the first surface without the die area, and a portion of the recessed area is remote from the side surfaces.
Dependencies are inferred from the claim text.