Method for cutting lead terminal of package type electronic component
AssigneeRohm Co., Ltd.
InventorMasahiko Kobayakawa
Life of this patent
Estimating the term…
Abstract
In an electronic component comprising a semiconductor chip packaged in a molded part from which the lead terminals of the semiconductor chip project, a main cutting notch is formed on the obverse surface of each lead terminal before molding the molded part while leaving unnotched portions adjoining both ends of the main notch. Then, each lead terminal is cut at the main notch after molding the molded part, thereby making fewer and smaller cutting burrs occurring at the cut faces.
Claims8
A method of cutting a lead terminal for a package type electronic component which comprises an element such as a semiconductor chip packaged in a molded part made of a synthetic resin with the lead terminal for said element projecting out of the molded part, the method comprising the steps of:
- indenting a main cutting notch on at least one of obverse and reverse surfaces of the lead terminal in a step before molding the molded part while leaving an unnotched portion between the main notch and each longitudinal side surface of the lead terminal, and then cutting the lead terminal at the main notch in a step after molding the molded part.
A method of cutting a lead terminal for a package type electronic component which comprises an element such as a semiconductor chip packaged in a molded part made of a synthetic resin with the lead terminal for said element projecting out of the molded part, the method comprising the steps of:
- indenting a main cutting notch on at least one of obverse and reverse surfaces of the lead terminal in a step before molding the molded part while leaving an unnotched portion between the main notch and each longitudinal side surface of the lead terminal, then indenting a cutting sub-notch at the unnotched portion in a step after molding the molded part, and then cutting the lead terminal at the main notch and the sub-notch.
Dependencies are inferred from the claim text.