Semiconductor package having semiconductor constructing body and method of manufacturing the same
AssigneeCasio Computer Co., Ltd.
InventorsTakeshi Wakabayashi, Shinji Wakisaka
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Abstract
A semiconductor package includes at least one semiconductor constructing body which has a semiconductor substrate and a plurality of external connection electrodes formed thereon. An insulating film covers the semiconductor constructing body. Each of interconnections which has a projecting electrode is formed on the insulating film. The projecting electrodes of the interconnection cut through the insulating film at portions corresponding to the external connection electrodes and electrically connected to the external connection electrodes.
Claims20
A method of manufacturing a semiconductor package, comprising:
- covering, with an insulating film, an upper surface of at least one semiconductor constructing body that includes a plurality of external connection electrodes;
- arranging, on the insulating film, a metal plate that includes projecting electrodes corresponding to the external connection electrodes;
- causing the projecting electrodes of the metal plate to cut through the insulating film and electrically connecting the projecting electrodes to the external connection electrodes;
- and
- forming interconnections to each include one of the projecting electrodes, by patterning the metal plate.
A method of manufacturing a semiconductor package, comprising:
- covering, with an insulating film, an upper surface of at least one semiconductor constructing body that includes a plurality-of external connection electrodes;
- arranging, on the insulating film, a metal plate that includes projecting electrodes corresponding to the external connection electrodes;
- causing the projecting electrodes of the metal plate to cut through the insulating film and electrically connecting the projecting electrodes to the external connection electrodes;
- and
- forming interconnections to each include one of the projecting electrodes, by patterning the metal plate, such that each of the interconnections comprises a substantially flat body extending on the insulating film;
- wherein each of the projecting electrodes gradually narrows from the flat body of the interconnection of which the projecting electrode is a part, toward the external connection electrode corresponding to the projection electrode.
Dependencies are inferred from the claim text.