Substrate having a plurality of I/O routing arrangements for a microelectronic device

A microelectronic assembly, comprising:

• a microelectronic device having a front surface and a plurality of electrical contacts arranged in a device contact pattern thereon;
• and
• a substrate comprising
• a support member having a substantially planar surface, and
• first, second, and third electrically device-attachable regions on the substantially planar surface, each region extending along a conductive path to corresponding terminal,
• wherein the first and third device-attachable regions form a first pattern, the second and third device-attachable regions form a second pattern, and the first and second patterns each correspond spatially to the device contact pattern.

A method for attaching a microelectronic device to a substrate, comprising:

• (a) providing a microelectronic device having a front surface and a plurality of electrical contacts arranged thereon in a device contact pattern;
• (b) providing a substrate comprising
• a support member having a substantially planar surface, and
• first, second, and third electrically device-attachable regions on the substantially planar surface, each region extending from along a conductive path to corresponding terminal,
• wherein the first and third device-attachable regions form a first pattern, the second and third-attachable regions form a second pattern, and the first and second patterns each correspond spatially to the device contact pattern;
• (c) bumping the electrical contacts;
• and
• (d) attaching the bumped electrical contacts to either the first or second pattern of device-attachable regions.