CMOS image sensor and method of fabricating the same
AssigneeSamsung Electronics Co., Ltd.
InventorsYoung-Hoon Park, Sang-Il Jung
Life of this patent
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Abstract
A CMOS image sensor and a method of fabricating the same are provided. The image sensor includes a blocking layer protecting a photodiode at a diode region. The blocking layer is formed to cover a top of the diode region and extended to an active region so as to cover a transfer gate and a floating diffusion layer. Therefore, the floating diffusion layer may not be attacked by an etching during a formation of sidewall spacers of various gates or by ion implantation during a formation of a junction region of a DDD or LDD structure, thus reducing a leakage current and a dark current at the floating diffusion layer.
Claims7
A method of fabricating a CMOS image sensor comprising:
- forming a device isolation pattern to define a diode region and an active region in a substrate;
- forming a photodiode in the diode region;
- serially forming a transfer gate, a reset gate and a selection gate separated from each other by a predetermined distance, wherein the transfer gate is formed on the active region adjacent to the diode region;
- forming a floating diffusion layer in the active region between the transfer gate and the reset gate and lightly doped diffusion layers in active regions at both sides of the selection gate;
- forming sidewall spacers on a sidewall of the reset gate facing the selection gate and sidewalls of the selection gate;
- simultaneously forming a blocking layer covering a top of the diode region and extended to the active region to cover the transfer gate and the floating diffusion layer;
- and
- implanting impurities into the active regions to form heavily doped diffusion layers that are aligned to outer surfaces of the sidewall spacers in the lightly doped diffusion layers.
Dependencies are inferred from the claim text.