Field emission device and manufacturing method thereof
AssigneeSemiconductor Energy Laboratory Co., Ltd.
InventorsHideto Ohnuma, Yukie Nemoto
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Abstract
It is an object to provide techniques for forming a field emission device of a field emission display device with the use of an inexpensive large-sized substrate according to the process that enables improving productivity. A field emission device according to the present invention includes a cathode electrode formed on an insulating surface of a substrate and a convex electron emission portion formed at a surface of the cathode electrode, and the cathode electrode and the electron emission portion include the same semiconductor film. The electron emission portion has a conical shape or a whiskers shape.
Claims25
A method for manufacturing a field emission device comprising:
- forming a semiconductor film over an insulating surface of a substrate;
- and
- irradiating a laser beam to the semiconductor film to form a conical convex portion.
A method for manufacturing a field emission device comprising:
- forming a semiconductor film in the shape of a stripe over an insulating surface of a substrate;
- forming an insulating film on the semiconductor film and the insulating surface;
- forming a gate electrode in the shape of a stripe on the insulating film;
- removing a portion of the gate electrode and a portion of the insulating film to expose the semiconductor film;
- and
- irradiating a laser beam to the semiconductor film to form a conical convex portion.
A method for manufacturing a field emission device comprising:
- forming a first conductive film in the shape of a stripe over an insulating surface of a substrate;
- forming a first insulating film on the insulating surface;
- forming a semiconductor film on the first conductive film and the first insulating film;
- processing the semiconductor film into a desired shape;
- forming a second insulating film on the semiconductor film in the desired shape;
- forming a second conductive film on the second insulating film;
- removing a portion of the second conductive film and a portion of the second insulating film to expose the semiconductor film;
- and
- irradiating a laser beam to the semiconductor film to form a conical convex portion.
A method for manufacturing a field emission device comprising:
- forming a semiconductor film over an insulating surface of a substrate;
- processing the semiconductor film into a desired shape;
- forming a first insulating film on the semiconductor film in the desired shape;
- forming a first conductive film on the first insulating film;
- forming a second insulating film on the first conductive film and the first insulating film;
- removing a portion of the first insulating film and a portion of the second insulating film to expose first and second portions of the semiconductor film;
- forming a second conductive film to have contact with the first portion;
- and
- irradiating a laser beam to the semiconductor film to form a conical convex portion in the second portion.
A method for manufacturing a field emission device comprising:
- forming a semiconductor film over an insulating surface of a substrate;
- adding a metal element to the semiconductor film;
- performing a first process to crystallize the semiconductor film and segregate the metal element or metal silicide at a grain boundary of the crystallized semiconductor film;
- and
- performing a second process in an atmosphere including gas including a semiconductor element to form a whiskers-shaped convex portion in the vicinity of a surface of the metal element or the metal silicide.
Dependencies are inferred from the claim text.