Methods of manufacturing an image device

A method of manufacturing an image device, the method comprising:

• forming a photodiode in a first region of a substrate including the first region and a second region;
• forming a first structure on the substrate, the first structure including an opaque upper portion and a transparent lower portion, the first structure including a wire and a capacitor lower electrode that are formed through the first structure, the wire being formed over the first region, the wire not being positioned over the photodiode, the capacitor lower electrode being formed over the second region;
• forming a dielectric layer on the first structure, the wire and the capacitor lower electrode;
• forming an etch stop layer pattern and a capacitor upper electrode on the dielectric layer, the etch stop layer pattern being positioned over the photodiode, the capacitor upper electrode being positioned over the capacitor lower electrode;
• forming a second structure including at least one opaque capping layer on the etch stop layer pattern and the first structure;
• and
• forming an opening over the photodiode by etching the second structure, the etch stop layer pattern and the opaque upper portion of the first structure, the opening exposing the transparent lower portion of the first structure.