Method for manufacturing a sensor chip and sensor chip blank
AssigneeMicronas Holding GmbH
InventorHolger Klapproth
Life of this patent
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Abstract
In a process for manufacturing a sensor chip a support is prepared having at least one surface region in which at least one reactive group is arranged. A buffer solution is applied to the surface region for coating at least one surface region. Then, at least one receptor having binding specificity for a ligand to be detected is brought into contact with the surface coating so obtained in such a manner that said receptor binds covalently to at least one reactive group.
Claims18
A process for manufacturing a sensor chip, wherein a support is prepared that has at least one surface region in which at least one reactive group is arranged, wherein a buffer solution is applied to the surface in order to coat at least one surface region, and wherein at least one receptor with binding specificity for a ligand that is to be detected is brought into contact with the surface coating so obtained, such that the receptor binds covalently to at least one reactive group.
A sensor chip blank having a support that has at least one surface region in which at least one reactive group is arranged that is capable of covalently bonding to a receptor, characterized in that at least one solid, paste-like and/or gel-like coating region containing at least one buffer substance is arranged on the surface region.
Dependencies are inferred from the claim text.