Photoresist formulation for high aspect ratio plating
AssigneeFormFactor, Inc.
InventorTreliant Fang
Life of this patent
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Abstract
SU-8 photoresist compositions are modified to improve their adhesion properties by adding 1% to 6% of an adhesion promoter selected from the group consisting of glycidoxypropanetrimethoxysilane, mercatopropyltrimethoxysilane, and aminopropyltrimethoxysilane. SU-8 photoresist compositions are modified to improve their resistance to cracking and film stress by adding 0.5% to 3% of a plasticizer selected from the group consisting of dialkylphthalates, dialkylmalonates, dialkylsebacates, dialkyladipates, and diglycidyl hexahydrophthalates. The improvements can be obtained simultaneously by adding both the adhesion promoter and the plasticizer to SU-8 photoresist compositions.
Claims25
1-26. (canceled)
A method comprising:
- providing a photoresist material, the photo resist material comprising:
- an octafunctional epoxidized novolac resin;
- an organic solvent;
- a photopolymerization initiator;
- a plasticizer selected from the group consisting of dialkylphthalates, dialkylmalonates, dialkylsebacates, and dialkyladipates;
- and
- an adhesion promoter selected from the group consisting of glycidoxypropanetrimethoxysilane, mercaptopropyltrimethoxysilane, and aminopropyltrimethoxysilane;
- depositing the photoresist material on a substrate;
- selectively exposing the deposited photoresist material to radiated energy, one or more portions of the photoresist being hardened and one or more portions of the photoresist being unhardened;
- and
- removing the one or more unhardened portions of the photoresist material from the substrate.
A method comprising:
- providing a photoresist material, the photo resist material comprising:
- an octafunctional epoxidized novolac resin;
- an organic solvent having a boiling point between 160° C. and 260° C.;
- a photopolymerization initiator;
- a plasticizer selected from the group consisting of dialkylphthalates, dialkylmalonates, dialkylsebacates, dialkyladipates, and diglycidyl hexahydrophthalates;
- and
- an adhesion promoter selected from the group consisting of glycidoxypropanetrimethoxysilane, mercaptopropyltrimethoxysilane, and aminopropyltrimethoxysilane;
- depositing the photoresist material on a substrate;
- selectively exposing the deposited photoresist material to radiated energy, one or more portions of the photoresist being hardened and one or more portions of the photoresist being unhardened;
- and
- removing the one or more unhardened portions of the photoresist material from the substrate.
A method comprising:
- providing a photoresist material, the photo resist material comprising:
- an octafunctional epoxidized novolac resin;
- an organic solvent comprising gamma butyrolactone;
- a photopolymerization initiator;
- a plasticizer selected from the group consisting of dialkylphthalates, dialkylmalonates, dialkylsebacates, dialkyladipates, and diglycidyl hexahydrophthalates;
- and
- an adhesion promoter selected from the group consisting of glycidoxypropanetrimethoxysilane, mercaptopropyltrimethoxysilane, and aminopropyltrimethoxysilane;
- depositing the photoresist material on a substrate;
- selectively exposing the deposited photoresist material to radiated energy, one or more portions of the photoresist being hardened and one or more portions of the photoresist being unhardened;
- and
- removing the one or more unhardened portions of the photoresist material from the substrate.
Dependencies are inferred from the claim text.