Chemically amplified positive photoresist composition for thick film, thick-film photoresist laminated product, manufacturing method for thick-film resist pattern, and manufacturing method for connection terminal

A chemically amplified positive photoresist composition for a thick film that is used for forming a thick-film photoresist layer with a film thickness of 10 to 150 μm on top of a support, comprising the following components:

• (A) a compound that generates an acid upon irradiation with active light or radiation;
• (B) a resin that displays increased alkali solubility under the action of the acid;
• and
• (C) an alkali-soluble resin, wherein
• said component (B) comprises a resin formed from a copolymer containing a structural unit (b1) represented by a general formula (1) shown below:
• (wherein, R1 represents a hydrogen atom or a methyl group, and R2 represents an acid-labile group), and wherein
• said component (C) comprises an acrylic resin (c1), and/or a vinyl resin (c2), wherein said vinyl resin (c2) is a poly(vinyl low alkyl ether), and comprises a (co)polymer produced by polymerizing either a single vinyl low alkyl ether represented by a general formula (8) shown below, a mixture of two of more of said ethers.
• (wherein in the general formula (8), R12 represents a straight chain or branched alkyl group of 1 to 5 carbon atoms)