Method for producing an exposed substrate

Method for producing a resist master, which has at least two different image areas, wherein a substrate is provided with a photoresist layer, and the photoresist layer in one image area is exposed with light radiation and in the other image area with particle radiation.

Method for producing a resist master, which at least has two different image areas, wherein onto a substrate, which is provided with a diffraction structure in the form of a relief structure, a photoresist layer is applied, and one of the image areas of the photoresist layer is exposed, and the not exposed areas of the photoresist layer are removed, so that the relief structure located therebelow is uncovered and forms the second image area.

Resist master with at least one photoresist layer, comprising a first image area which is exposed with light radiation, and a second image area which is exposed with particle radiation.

Resist master comprising at least two photoresist layers, wherein each photoresist layer is exposed in at least one image area and the image areas in the two photoresist layers are exposed with different types of radiation.

Resist master comprising at least one photoresist layer having a first image area, which has a first image area which is exposed with a grating image of zero-order, and a second image area which is exposed with a grating image of first-order.

Resist master comprising at least two photoresist layers, wherein each photoresist layer is exposed in at least one image area and the photoresist layers have a different layer thickness.

Method for producing a resist master, wherein onto an already structured carrier material an embossable lacquer layer is applied, in which a grating image is embossed.