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AssigneeUbe Industries, Ltd., a corporation of Japan
InventorsTakashi Kino, Masafumi Kohda, Masato Murakami, Hiroaki Yamaguchi
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A polyimide film with improved adhesion obtained by forming a thin polybenzimidazole layer on one or both sides of a polyimide film, a process for fabrication of a polyimide film with improved adhesion whereby an organic polar solvent solution containing a polybenzimidazole is coated or sprayed onto one or both sides of a self-supporting film prepared by casting and drying a dope, which is an organic polar solvent solution of a polyimide precursor which may contain an imidization catalyst, onto a support, and the film is then thoroughly heat treated, a cover lay film obtained by laminating a cover lay film adhesive onto the polyimide film with improved adhesion, and a laminated body employing the polyimide film with improved adhesion. The polyimide film exhibits the excellent characteristics of aromatic polyimide films including thermal properties, physical properties and electrical properties, while also having satisfactory adhesion.
A polyimide film with improved adhesion obtained by coating or spraying an organic polar solvent solution containing a polybenzimidazole onto one or both sides of a self-supporting film prepared by casting and drying a dope, which is an organic polar solvent solution of a polyimide precursor which may contain an imidization catalyst, onto a support and then thoroughly heat treating the film.
A process for fabrication of a polyimide film with improved adhesion whereby an organic polar solvent solution containing a polybenzimidazole is coated or sprayed onto one or both sides of a self-supporting film prepared by casting and drying a dope, which is an organic polar solvent solution of a polyimide precursor which may contain an imidization catalyst, onto a support, or a film having a surface condition which is equivalent thereto, and the film is then thoroughly heat treated.
Dependencies are inferred from the claim text.