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US 2006/0141259 A1Published application
Printed circuits on shrink film
Assignee3M Innovative Properties Company
InventorsJessica Voss-Kehi, Kurl Halverson, Caroline Ylitalo, Matthew Lehmann, Steven Botzet
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Abstract
Methods of creating fine featured circuits by printing a circuit trace onto polymer shrink films or other biaxially-oriented polymer films are disclosed. The shrink films are heated and shrunk after printing, annealing the circuit trace to form conductive features. Compositions suitable for printing onto the films and articles made using the method and composition are also disclosed.
Claims19
A method of forming a conductive trace, the method comprising:
- providing a shrinkable polymeric film;
- depositing a substantially non-conductive coating on a portion of the polymeric film;
- and
- elevating the temperature of the shrinkable polymeric film and the substantially non-conductive coating such that the projected surface area of the polymeric film shrinks by at least 50 percent and the non-conductive coating becomes at least 100 percent more conductive.
1 more element
A method of forming a conductive trace, the method comprising:
- providing a shrinkable polymeric film;
- depositing a coating on a portion of the polymeric film;
- and
- elevating the temperature of the shrinkable polymeric film such that the projected surface area of the film shrinks by at least 80 percent such that the coating forms a conductive trace.
1 more element
Dependencies are inferred from the claim text.