Cleaning substrate of substrate processing equipment and heat resistant resin preferable therefor
AssigneeNitto Denko Corporation
InventorsYoshio Terada, Hirofumi Fujii, Makoto Namikawa, Daisuke Uenda, Yasuhiro Amano
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Abstract
The present invention provides a cleaning substrate of a substrate processing equipment, which comprises a cleaning layer comprising a heat resistant resin with a storage modulus (1 Hz) at 20° C. up to 150° C. being 5×107 Pa to 1×109 Pa on at least one face of the substrate; and a polyimide resin suitable as the heat resistant resin for the cleaning layer and usable under circumstances possibly involving the generation of serious disadvantages due to silicone contamination, such as for HDD application and some semiconductor applications.
Claims20
A cleaning substrate of a substrate processing equipment, which comprises:
- a substrate, and
- a cleaning layer comprising a heat resistant resin with a storage modulus (1 Hz) at 20° C. up to 150° C. being 5×107 Pa to 1×109 Pa on at least one face of the substrate.
A heat resistant resin obtained by polymerizing together tetracarboxylic dianhydride and a compound at least containing a polyether structure and having at least two terminal amine structures as a diamine component.
A heat resistant resin having a structure unit represented by the formula (R1):
- wherein a represents an integer of 2 or more and Ar represents a structure containing at least one aromatic ring.
A heat resistant resin having a structure unit represented by the formula (R2):
- wherein b, c and d each independently represents an integer of 0 or more, provided that b+c+d is 2 or more and Ar represents a structure containing at least one aromatic ring.
A heat resistant resin having a structure unit represented by the formula (R3):
- wherein e, f and g each independently represents an integer of 0 or more, provided that e+f+g is 2 or more and Ar represents a structure containing at least one aromatic ring.
A heat resistant resin having a structure unit represented by the formula (R4):
- wherein h represents an integer of 1 or more and Ar represents a structure containing at least one aromatic ring.
Dependencies are inferred from the claim text.