Printed circuit board and camera module
AssigneeFuji Photo Film Co., Ltd.
InventorSetsu Takeuchi
Life of this patent
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Abstract
A printed circuit board has a flexible portion where a covering layer is exposed, and a rigid portion provided by forming a resistant layer on a part of the covering layer. To produce a camera module, a lens unit and a CCD are affixed to the printed circuit board through an adhesive, wherein the CCD is located inside the lens unit. The rigid portion has a top surface that is substantially equal in shape and size to an outline of a bottom surface of the lens unit, so the top surface of the rigid portion serves as a coating area for the adhesive.
Claims11
A printed circuit board comprising a number of layers including a wiring layer formed with a circuit pattern and a covering layer covering said wiring layer, wherein at least a separate component may be affixed to said printed circuit board through an adhesive that is put on a designated coating area in a surface of said printed circuit board, and said coating area is marked by differentiating layered structure at least in a border of said coating area.
A camera module comprising a lens unit, an imaging device and a printed circuit board, said printed circuit board comprising a number of layers including a wiring layer having a circuit pattern and a covering layer covering said wiring layer, said lens unit and said imaging device being affixed to said printed circuit board through an adhesive that is put on a designated coating area in a surface of said printed circuit board, said coating area being marked by differentiating layered structure of said printed circuit board at least in a border of said coating area.
Dependencies are inferred from the claim text.