Highly heat-transferring substrate and process of manufacturing the same
AssigneeInsight Electronic Group Inc.
InventorsYu Huang, Min-Chung Lu
Life of this patent
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Abstract
A highly heat-transferring substrate is manufactured by drilling holes on a metal material of high heat conductivity, such as aluminum; positioning the metal material between two copper foil layers; applying a highly heat-transferring gum between the metal material and the copper foil layers; and melting the gum using a high temperature produced during pressing the metal material and the copper foil layers together. The melted gum bonds the metal material to the copper foil layers and flows into the holes on the metal material to form an insulating coating, which allows the finished substrate to be drilled and plated without the risk of short circuit caused by contacted metal material and plated coating.
Claims15
A process for manufacturing a highly heat-transferring substrate, comprising the steps of:
- a. Preparing a desired metal material and giving it roughened surfaces;
- b. Drilling holes of predetermined diameters on the roughened metal material using a drilling machine;
- c. Filling a space between each surface of the metal material and a copper foil layer with a type of highly heat-transferring gum;
- and
- d. Firmly pressing the metal material and the copper foil layer together.
A highly heat-transferring substrate, comprising:
- a metal material;
- a layer of highly heat-transferring gum laid over each surface of the metal material to serve as an insulating and bonding medium;
- and
- at least one copper foil layer formed over each layer of the highly heat-transferring gum.
Dependencies are inferred from the claim text.