Heat-sensitive adhesive material
OwnerTomoyuki Kugo, Toshiaki Ikedainventors
Life of this patent
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Abstract
A heat-sensitive adhesive material includes a substrate, a heat-sensitive adhesive layer containing a thermoplastic resin and a solid plasticizer formed on the substrate, and a heat-fusible substance capable of depressing the solidifying point of the solid plasticizer in at least one of the heat-sensitive adhesive layer and a layer adjacent to the heat-sensitive adhesive layer. The heat-fusible substance satisfies the following condition (A): E1<E2 where E1 is heat energy to fuse the solid plasticizer; and E2 is heat energy to fuse the heat-fusible substance.
Claims9
1-12. (canceled)
A method for activating a heat-sensitive adhesive material comprising:
- a step for applying energy to the heat-sensitive adhesive material using a thermal head;
- and
- a step for controlling the quantity of the applied energy by controlling the conducting period of the thermal head,
- wherein the heat-sensitive adhesive material comprises:
- a substrate;
- a heat-sensitive adhesive layer containing a thermoplastic resin and a solid plasticizer formed on the substrate;
- and
- a heat-fusible substance capable of depressing the solidifying point of the solid plasticizer, the heat-fusible substance present in at least one of the heat-sensitive adhesive layer and a layer adjacent to the heat-sensitive adhesive layer,
- the heat-fusible substance satisfying the following condition (A):
- E 1<E2 (A)
- where E1 is heat energy to fuse the solid plasticizer;
- and E2 is heat energy to fuse the heat-fusible substance.
A method for applying a heat-sensitive adhesive material comprising:
- a step for applying energy to the heat-sensitive adhesive material using a thermal head to exhibit adhesion to thereby apply the heat-sensitive adhesive material to an adherend,
- wherein the heat-sensitive adhesive material comprises:
- a substrate;
- a heat-sensitive adhesive layer mainly containing a thermoplastic resin and a solid plasticizer formed on the substrate;
- and
- a heat-fusible substance capable of depressing the solidifying point of the solid plasticizer, the heat-fusible substance present in at least one of the heat-sensitive adhesive layer and a layer adjacent to the heat-sensitive adhesive layer,
- the heat-fusible substance satisfying the following condition (A):
- E 1<E2 (A)
- where E1 is heat energy to fuse the solid plasticizer;
- and E2 is heat energy to fuse the heat-fusible substance.
Dependencies are inferred from the claim text.