Processes for forming layers for electronic devices using heating elements

Abstract

A process for forming an electronic device includes placing a substrate adjacent to a heating element and a deposition source, wherein the deposition source lies between the substrate and the heating element. In one embodiment, the process also includes sending a multiple pulsed signal to the heating element such that the heating element is on and off for a plurality of times. In another embodiment, the process also includes sending a signal to the heating element and depositing a layer over the substrate. Either or both processes further includes depositing a layer over the substrate. Depositing occurs as a result of sending the multiple pulsed signal to the heating element. The layer includes a material from the deposition source.

Dependencies are inferred from the claim text.