Light-emitting unit with enhanced thermal dissipation and method for fabricating the same

A light-emitting package comprising:

• a plurality of light-emitting units in which each unit includes:
• a housing;
• a heat sink member having surfaces outside of the housing;
• and
• a light emitting diode attached to the heat sink member;
• a heat sink plate for dissipating heat;
• recesses respectively corresponding to each of the plurality of light-emitting units;
• and
• a printed circuit board having an electrode for supplying electric power to the light emitting diode of each of the plurality of light-emitting units,
• wherein the heat sink member of each of the plurality of light-emitting units is within a corresponding recess of the heat sink plate.

A method for fabricating a light-emitting package, comprising:

• forming a plurality of light-emitting units that each include a housing, a heat sink member having surfaces outside of the housing, and a light-emitting diode attached to the heat sink member;
• forming a heat sink plate having a plurality of recesses corresponding to each of the light-emitting units, and a printed circuit board having an electrode for supplying electric power to the light-emitting units;
• and
• positioning each of the heat sink members for the light-emitting units within the corresponding recess in the heat sink plate for the light-emitting unit.

A backlight unit comprising:

• a frame;
• a plurality of light-emitting packages disposed on the frame, each of the light-emitting packages including:
• a printed circuit board having a heat sink plate with a plurality of recesses formed therein;
• a plurality of light-emitting units that each have a heat sink member attached inside the corresponding recess of the heat sink plate, the heat sink member being outside;
• and
• a diffusion plate disposed over the light-emitting package to diffuse light emitted from the light-emitting package.