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US 2006/0139896 A1Published application
Packaging for electronic modules
AssigneeAgere Systems Inc.
InventorsTimothy Bambridge, Juan Herbsommer, Osvaldo Lopez, Joel Lott, Hugo Safar, Thomas Shilling
Life of this patent
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Abstract
An electronic module has a non-conducting substrate having at least one opening and a die/carrier assembly mounted within the opening in the substrate. The assembly has a conducting carrier and one or more integrated circuit (IC) dies mounted to the carrier. The invention may be implemented as an electronic system comprising a circuit board (CB) and at least one such electronic module mounted to the CB.
Claims20
An electronic module comprising:
- a non-conducting substrate having at least one opening;
- and
- a die/carrier assembly mounted within the opening in the substrate and comprising:
- a conducting carrier;
- and
- one or more integrated circuit (IC) dies mounted to the carrier.
3 more elements
An electronic system comprising:
- a CB;
- and
- at least one electronic module mounted to the CB and comprising:
- a non-conducting substrate having at least one opening;
- and
- a die/carrier assembly mounted within the opening in the substrate and comprising:
- a conducting carrier;
- and
- one or more integrated circuit (IC) dies mounted to the carrier.
6 more elements
Dependencies are inferred from the claim text.