Heat dissipating arrangement for an electronic appliance
AssigneeKoninklijke Phillips Electronics N.V.
InventorCornelis Mies
Life of this patent
Estimating the term…
Abstract
An electronic appliance, such as a computer and the like, comprising a printed circuit board with printed circuits arranged thereon and electromagnetic components electrically connected thereto, as well as a heat dissipating arrangement for dissipating heat generated by the components to the surrounding atmosphere, a special feature being the fact that the heat dissipating arrangement comprises a heat sink with several separate thermal conductors which are thermically connected to the printed circuits, which thermal conductors can be arranged on the printed circuit board in various positions, each position corresponding to a predetermined heat dissipation direction.
Claims8
An electronic appliance, such as a computer and the like, comprising a printed circuit board with printed circuits arranged thereon and electromagnetic components electrically connected thereto, as well as a heat dissipating arrangement for dissipating heat generated by the components to the surrounding atmosphere, characterized in that the heat dissipating arrangement comprises a heat sink with several separate thermal conductors which are thermically connected to the printed circuits, which thermal conductors can be arranged on the printed circuit board in various positions, each position corresponding to a predetermined heat dissipation direction.
A method of manufacturing an electronic appliance, such as a computer and the like, starting from a printed circuit board comprising printed circuits arranged thereon and electromagnetic components thermically connected thereto, and a heat dissipating arrangement for dissipating heated generated by components to the surrounding atmosphere, characterized in that the heat dissipating arrangement consists of a heat sink comprising several separate thermal conductors which are electrically connected to the printed circuits, which thermal conductors can be arranged in various positions on the printed circuit board, each position corresponding to a predetermined heat dissipation direction.
Dependencies are inferred from the claim text.