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US 2006/0139886 A1Published application
Spring adapted to hold electronic device in a frame
AssigneeHewlett-Packard Development Company, L.P.
InventorStephan Barsun
Life of this patent
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Abstract
An assembly comprises a frame adapted to mount an electronic device having a thickness within a range of thicknesses. The frame is adapted to assemble to a heat sink assembly after the electronic device is mounted. The assembly further comprises at least one spring adapted to secure the electronic device to the frame.
Claims27
An assembly comprising:
- a frame adapted to mount an electronic device having a thickness within a range of thicknesses, the frame being further adapted to assemble to a heat sink assembly after the electronic device is mounted;
- and
- at least one spring adapted to secure the electronic device to the frame.
An assembly comprising:
- a field replaceable unit adapted to mount an electronic device having a thickness within a range of thicknesses;
- at least one spring adapted to secure the electronic device to the field replaceable unit;
- and
- a heat sink assembly in a configuration that secures to the field replaceable unit after mounting of the electronic device.
1 more element
A method of constructing an electronic assembly comprising:
- providing a field replaceable unit adapted to mount an electronic device;
- mounting the electronic device to the field replaceable unit;
- securing the electronic device to the field replaceable unit using a spring;
- and
- fastening a heat sink assembly to the field replaceable unit.
2 more elements
Dependencies are inferred from the claim text.