Scanner apparatus with twin substrate stage, semiconductor photo equipment with the apparatus and method of manufacturing a semiconductor device using the equipment
AssigneeSamsung Electronics Co., Ltd.
InventorJoo-sung Jung
Life of this patent
Estimating the term…
Abstract
A scanner apparatus includes an exposure unit and an alignment unit, wherein the alignment unit includes an aligning/leveling apparatus for performing global aligning and leveling processes for a wafer in the alignment unit and an edge exposure apparatus, receiving light from a light source, for performing an edge exposure process for the wafer in the alignment unit.
Claims19
A scanner apparatus having an exposure unit and an alignment unit, wherein the alignment unit comprises:
- an aligning/leveling apparatus for performing global aligning and leveling processes for a wafer in the alignment unit;
- and
- an edge exposure apparatus, receiving light from a light source, for performing an edge exposure process for the wafer in the alignment unit.
A semiconductor photo equipment comprising:
- a spinner apparatus and a scanner apparatus arranged inline, wherein the scanner apparatus includes:
- an exposure unit having an exposure substrate stage and an alignment unit having an alignment substrate stage, wherein the alignment unit includes:
- an aligning/leveling apparatus for performing global aligning and leveling processes for a wafer installed on the alignment substrate stage;
- and
- an edge exposure apparatus receiving light from a light source and for performing an edge exposure process for the wafer.
A semiconductor manufacturing method using a semiconductor photo equipment having a scanner apparatus and a spinner apparatus arranged to be inline with the scanner apparatus, the scanner apparatus including an alignment unit and an exposure unit, the method comprising:
- performing aligning and leveling processes for a wafer in the alignment unit;
- performing an wafer edge exposure process for the wafer in the alignment unit;
- and
- performing a main exposure process for the wafer in the exposure unit.
Dependencies are inferred from the claim text.