Active matrix display device and manufacturing method of the same
AssigneeNEC LCD Technologies, Ltd.
InventorKazuhide Yoshinaga
Life of this patent
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Abstract
Active matrix display device includes connection wirings passing through a sealing material. The connection wirings are sandwiched between inorganic interlayer insulation film and an organic planarizing film. The organic film is selectively removed at a seal region to form opening portions to expose the inorganic film and to be filled with a sealing material. The sealing material contacts the lower layer inorganic interlayer insulation film in the bottom of an opening portion to increase the adhesive strength.
Claims13
An active matrix display device comprising:
- a first substrate having picture elements arranged in matrix to form a display region;
- a second substrate bonded to the first substrate by using a sealing material so as to provide a seal region surrounding the display region;
- a group of connection wirings formed on the first substrate to pass through the sealing material such that one ends of the connection wirings are connected to the picture elements and the other ends thereof are located outside of the sealing material;
- an inorganic insulating film provided under the connection wirings;
- and
- an organic insulating film provided on the connection wirings, the organic insulating film being selectively removed at the seal region to form an opening portion filled with the sealing material except for regions on the connection wirings.
A manufacturing method of an active matrix display device comprising:
- forming a thin film transistor on a display region of a first substrate;
- forming an inorganic insulating film on the thin film transistor;
- removing the inorganic insulating film on an electrode of the thin film transistor to form a first through hole;
- forming a first connection wiring and a second connection wiring such that the second connection wiring is connected via the first through hole to an electrode of the thin film transistor;
- forming at least an organic insulating film on the first connection wiring and the second connection wiring;
- removing a part of the organic insulating film on the second connection wiring of the display region to form a second through hole, and removing a part of the organic insulating film in a seal region, except for the region where the first connection wiring is formed, to form a opening portion;
- and
- forming on the display region a picture element electrode connected to the second connection wiring via the second through hole;
- and
- bonding a second substrate to the first substrate by using a sealing material at the seal region such that the first connection wiring and the second connection wiring are passed through the sealing material and the opening portion is filled with the sealing material.
Dependencies are inferred from the claim text.