Intelligent high-power amplifier module
AssigneeAgere Systems Inc.
InventorsTimothy Bambridge, Juan Herbsommer, Osvaldo Lopez, Joel Lott, Khanh Nguyen
Life of this patent
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Abstract
An amplifier module has a substrate, as assembly having one or more integrated circuit (IC) dies mounted to the substrate, and one or more other electronic components mounted to the substrate. The assembly receives an input signal and generates an amplified output signal. The one or more other electronic components perform one or more amplifier-related functions. The amplifier module is adapted to be mounted to a circuit board (CB) as a distinct electronic package. The invention may be implemented as an electronic system having the CB and at least one such amplifier module mounted to the CB.
Claims18
An amplifier module, comprising:
- a substrate;
- an assembly having one or more integrated circuit (IC) dies mounted to the substrate and adapted to receive an input signal and generate an amplified output signal;
- and
- one or more other electronic components mounted to the substrate and adapted to perform one or more amplifier-related functions, wherein the amplifier module is adapted to be mounted to a circuit board (CB) as a distinct electronic package.
An electronic system comprising:
- a CB;
- and
- at least one amplifier module mounted to the CB and comprising:
- a substrate;
- an assembly having one or more integrated circuit (IC) dies mounted to the substrate and adapted to receive an input signal and generate an amplified output signal;
- and
- one or more other electronic components mounted to the substrate and adapted to perform one or more amplifier-related functions, wherein the amplifier module is mounted to the CB as a distinct electronic package.
Dependencies are inferred from the claim text.